Optoprofiler LLC - Products
Tool for BOW, WARP, STRESS and full TOPOGRAPHY  
MEASUREMENTS of wafers, solar cells and glass
metrology


Opto-Profiler system is optimum solution for measurement of bow and
warp
of highly warped and structured wafer, solar cell, and other surfaces.
Range of applications includes:

  • Solar cell metrology
  • Coated glass flatness metrology
  • Mechanical parts metrology
  • Flat parts metrology
  • Plastic, Metal and Composite Parts
  • Micro-sockets (with microscope option)
  • Laboratory components
  • Packaging solutions for
  • pharmacological industry

Product features

Zebra Opto-Profiler has following standard features (other features may
be
implemented as engineering standard):

Measures wafers from 0.5'' to 12'' diameter (Model P-1D or A3 up  to   
45 cm x 45 cm  Model P-2E) . Special macro-lens option available for
samples smaller than 0.5'' (so called MACRO option)
Measures rough surfaces, wet, surfaces
Non-contact method

Please
contact our marketing department for sample of measurement
report.

Request sample measurements

Please
contact us and arrange for our lab to provide you with
measurement
on your own samples to better evaluate our Zebra Opto-Profiler
technology.

Competitive advantages

1. Our tool in addition to topography also calculates _tensor_stress_ for
simple patterns. This is quite unique feature.  

2. When considering capacitance competitors tools please note that they
tend to be optimized for round wafers. Please also notice significant edge
exclusion.

3. When considering microscope scanners please note that most of them
are performing 1D scan only in reasonable time.

4. Interferometers tend to perform poorly on structured or rough surface
(paint). Our tool does not have this problem.

5. We will be also happy to implement your sample holder requirements
even if they deviate from SEMI standards.

Principle of Operation


Opto-profiler measures topography of surface by projecting pattern.
Projected pattern is recorded by CCD camera system  and analyzed in real
time by image analysis software. Curved surface of measured samples
distort recorded fringe image pattern. Surface topography is measured by
measuring distortion of observed pattern.

Data acquisition with high resolution camera (offered with 5 MPixels and
more)

Proprietary algorithm analyzes the observed distortion of projected
pattern,
and provides fast, and accurate measurements of topography of uniform,
colored, and patterned surfaces. Analysis time is 10-50 seconds
depending
on features of measured surfaces. For repetitive measurements of similar
surfaces (as it is often encountered in mass production) measurement and
analysis can be further reduced to below 1 sec.
System employs class I light sources, and is safe for humans and animals.

Hardware platform

The optoprofiler hardware platform is based on robust frame. The external
tool frame is vibration isolated from the internal metrology platform
comprising sensors, light sources and sample compartment.  We provide
more information and photographs on hardware at this link.

Please contact our sales department for brochure describing metrology
and its specification in detail.

Our application engineers will be happy to provide you with specifications
corresponding to your specific application, and will be happy
to arrange system demonstration.  

Your name:
Your email address:
Your phone number:
Comments/Requests:
Model P-1D
Model P-2E for large
wafers and minipanels
Model P-1PORT