OPTOPROFILER 200 A SCANNING SYSTEM FOR WAFER THICKNESS, TOP0GRAPHY, AND STRESS CHARACTERIZATION



Metrology of complex multilayer wafers



Optoprofiler 200 mm is a new tool for front-end and backend (backgrind) wafer metrology developed and manufactured by Optoprofiler LLC a Florida Company. We would like to invite interested parties including: prospective customers, representatives, distributors, manufacturing and marketing and distribution companies industrial artists to improve graphical materials :-) to submit their proposals and/or samples for tool evaluation, and to arrange a beta demonstration of the tool. Interested parties are welcome to contact us at sales@optoprofiler.com or call us at 1 267 626 3075. More information on our company can be found on our web site optoprofiler.com.





The Optoprofiler 200 tool has a very transparent two-compartment design. The lower compartment contains a signal processing unit, photonics units, and computer controlling system. The modular system architecture allows fast service and installation of the system. The lower compartment contains standardized rack modules allowing fast replacement and upgrade of the tool. The upper compartment contains sensors, motion stages, and electro-mechanical components positioning wafer and sensors during preprogrammed measurements.